Copper Powder
Cu Powder
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Spherical Copper Cu powder is prepared by the plasma rotary electrode atomized process. Under the electron microscope, it is a uniform spherical powder with strong fluidity, red and yellowish powder, uniform particle size distribution, sphericity, good fluidity, and high specific gravity. Mainly used for powder metallurgy parts, plasma spraying, 3D printing, electric carbon products and friction materials, filters, surface spraying, laser cladding, perforating ammunition cores, etc.
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20-60um
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45-105um
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45-150um
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PSD |
0-20um, 15-45um, 20-60um, 45-105um, 45-150um |
Purity |
0.999 |
Oxygen Content |
<300 ppm |
Sphericity |
>95% |
Application |
Additive Manufacturing, Laser Cladding, PM, HP, Spraying |
Standard |
ASTM B348, ASTM F136, ASTM F1580, ASTM F2924, ASTM F3001, AMS 1498 |
Particle Size Distribution Copper Powder
Particle size distribution is measured by laser diffraction as per ASTM B822. Due to the Almost no satellite powder and hollow powder, high sphericity with excellent fluidity, low oxygen content on AM Co., Ltd. powder, the particle size distribution is highly uniform and the D10, D50 and D90 meet and exceed the industry requirements with an exceptional batch to batch reliability. The typical powder of plasma rotary electrode atomized process yield ranges from 0-150 µm, after atomization, the powder is sieved according customer specifications.